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Chi Hwan Lee is a Professor in the School of Mechanical Engineering at Purdue University, specializing in Biomedical Engineering and Mechanical Engineering. He received his PhD in Mechanical Engineering from Stanford University in 2013, following an MS from the same institution in 2008 and a BSE from the Illinois Institute of Technology in 2007. His research interests include wearable biomedical devices, crack-driven transfer printing technology, scalable manufacturing technology, and the mechanics of materials and flexible/stretchable electronics. He is involved in fundamental research areas such as Solid Mechanics and applications including Biomedical systems and Human-Machine Interaction. His work has garnered multiple awards, including the Talk Award at the Postdoctoral Research Symposium held at the Beckman Institute in 2014, the Graduate Silver Award from the Materials Research Society in 2013, and the Top Innovation Award at the TechConnect World National Innovation Summit in Washington D.C. in 2013.
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