Dr. Marek Skowronski

Professor

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Biography

Marek Skowronski is a Professor in the Department of Materials Science and Engineering at Carnegie Mellon University. He obtained his Ph.D. in Solid State Physics from Warsaw University. Following his doctoral studies, he held a postdoctoral position at the Massachusetts Institute of Technology, where he utilized junction spectroscopy to study compound semiconductors. In 1988, he moved to Carnegie Mellon University and has focused his research on the deposition of thin films for electronic applications and the fabrication of energy-efficient devices. His work includes electron microscopy and aims to discover, understand, and manufacture novel materials and device structures for information storage and processing. A key aspect of his research is enhancing energy efficiency in next-generation computing, addressing the global energy implications of information technology. Skowronski's group collaborates with various institutions, including Intel, Micron, and the National Institute of Standards and Technology, to tackle challenges in non-volatile memory devices, neuromorphic computing, and scalability beyond current technology limits.

Research Interests

Experience

Professor

— Present

Carnegie Mellon University • Pittsburgh, PA, USA

Teaching and conducting research in the field of Materials Science and Engineering, focusing on thin films and electronic applications.

Requirements for Carnegie Mellon University

Doctorate Program
Requirements
GPA Requirement
Required:3.5
GRE General
Verbal
Required:158
Quantitative
Required:149
Analytical Writing
Required:4
Overall
Required:4
Prerequisites
Bachelor's degree in Psychology or related field Research experience/publications
Application Checklist
  • Online application
  • Statement of Purpose
  • Three letters of recommendation
  • Transcripts
  • GRE scores (optional but reported in profile)
  • English Proficiency (TOEFL/IELTS/Duolingo)
Specialization Notes

Admission is extremely competitive with no strict GPA cut-offs; holistic review is used.