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Michael Mayer is an Associate Professor in the Department of Mechanical and Mechatronics Engineering at the University of Waterloo in Ontario, Canada. He holds a Diploma in Physics (1994) and a PhD in Technical Sciences (2000) from the Swiss Federal Institute of Technology Zurich (ETH Zurich). With prior experience as a senior R&D engineer at ESEC in Switzerland, Michael has led various projects with companies including Microbonds Inc., Intel Corp., and Tesla. His research focuses on advanced bonding methods for microsensor tools and biological materials, as well as studies in experimental mechanics with new materials. Michael serves on the executive committee for the IEEE Electronics Components Technology Conference and has co-authored numerous technical publications and patents. His academic group conducts research in collaboration with industry partners, preparing graduate students for successful careers in the field of engineering.
ESEC • Switzerland
Led research and development projects as a senior engineer at a semiconductor equipment manufacturer.
Includes fields like Clinical, Cognitive, Developmental, and Industrial/Organizational Psychology.