Generate a tailored SOP for Dr. Rao Tummala. Improve your application with a focused, well-structured draft.
Professor Rao Tummala held the Joseph M. Pettit Chair in Electronics Packaging at the School of Electrical and Computer Engineering and a joint faculty appointment in the School of Materials Science and Engineering at Georgia Tech from 1993 to 2019. He was the founding director of the NSF Engineering Research Center (ERC) called Microsystems Packaging Research Center (PRC), which is focused on pioneering advancements in Law Electronics and System-On-Package (SOP) technologies. His work led to significant developments in microsystems packaging and fostered collaborations involving 200 students and 40 global companies. Prior to joining Georgia Tech, he worked as a Fellow at IBM Corporation where he invented several major technologies and served as a technical leader in the flat panel display industry. Professor Tummala has published 800 technical papers, authored several reference books, and holds 110 U.S. patents. He has received numerous awards recognizing his contributions to engineering and education, including the IEEE Fellow and various distinguished awards from professional societies.
Georgia Institute of Technology • Atlanta, GA, USA
Held the Joseph M. Pettit Chair in Electronics Packaging, founded and directed the Microsystems Packaging Research Center.
Department of Computer Science: GRE scores are optional for Fall 2026.