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William Nix has engaged in the study of mechanical properties of materials for over 50 years. His early work focused on high temperature creep and fracture of metals, particularly techniques for measuring internal back stresses in deforming metals. His research has revolved around understanding dispersion strengthening mechanisms, threshold stresses in creep processes, and the mechanical properties of thin film materials used in microprocessors. Nix has developed innovative techniques for studying thin film mechanical properties, including nanoindentation and substrate curvature methods. His work also delves into the mechanisms of strain relaxation in heteroepitaxial thin films and the plastic deformation of thin metal films on substrates. More recently, he has researched the mechanical properties of nanostructures, studying the effects of strain gradients and size on the properties of crystalline materials, particularly in relation to lithium-ion battery applications.
Stanford University • Stanford, CA
Emeritus faculty member in the Department of Materials Science and Engineering, focusing on the mechanical properties of materials.
The Computer Science department emphasizes research potential. GRE General is currently optional but recommended for some tracks.