Dr. Muhannad Bakir

Biography

Muhannad S. Bakir received his B.E.E. degree from Auburn University in 1999 and M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology in 2000 and 2003, respectively. He is currently the Dan Fielder Professor in the School of Electrical and Computer Engineering and director of the 3D Systems Packaging Research Center. Dr. Bakir is recognized for his contributions with several awards, including the 2013 Intel Early Career Faculty Honor Award, the 2012 DARPA Young Faculty Award, and the 2011 IEEE CPMT Society Outstanding Young Engineer Award. He has led his research group to receive over 25 conference student paper awards. Additionally, he has authored or co-authored more than 180 journal publications and conference proceedings, and holds 12 patents. Dr. Bakir's research interests include heterogeneous microsystem design integration, 2.5D and 3D IC packaging, advanced cooling and power delivery, emerging system architectures, electrical and photonic interconnect technologies, and biosensor technologies integration. He has served as an editor for IEEE Transactions on Electron Devices and is on the editorial board of IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Research Interests