25d And 3d Ic Packaging Professors in Global

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Sung Lim
University of Southern California United States of America
2.5d integrated circuits
3d integrated circuits
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Jm Goddard
Cornell University Netherlands
intelligent packaging
food packaging
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Guy Curry
Texas A&M University United States of America
semiconductor packaging
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Jihoon Jeong
Texas A&M University United States of America
semiconductor packaging
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Mohammad Rafiee
University of Ottawa Canada
semiconductor packaging
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Li Ran
University of Warwick United Kingdom
power semiconductors packaging
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Tathagata Srimani
Carnegie Mellon University United States of America
3d integrated circuits
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Ghulam Destgeer
Technical University of Munich Germany
3d fabrication of particles
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Grete Bertelsen
University of Copenhagen Denmark
food packaging
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Sabina Rietz Dahlström
KTH Royal Institute of Technology Sweden
food packaging
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Richard Olsson
KTH Royal Institute of Technology Sweden
food packaging
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Erica Van Herpen
Wageningen University & Research Netherlands
food packaging
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Tamer Uyar
Cornell University Netherlands
food packaging
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Helene Hopfer
Pennsylvania State University United States of America
food packaging
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Gobinda Saha
University of New Brunswick Canada
3d coatings
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Jacques Albert
Carleton University Canada
photonic packaging
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Peter Herman
University of Toronto Canada
photonic packaging
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Rony Amaya
Carleton University Canada
packaging
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Judd Michael
Pennsylvania State University United States of America
packaging
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Gregory Rutledge
Massachusetts Institute of Technology United States of America
packaging
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Sandra Krahn
Technical University of Berlin Germany
packaging
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