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Dr. Mohammad Rafiee received his Ph.D. degree in Mechanical Engineering from the University of Ottawa. His research activities mainly encompass numerical, machine learning, multi-physics simulations, and the experimental development of advanced semiconductor packages and electronic materials. He has focused on manufacturing aspects of design, modeling, processing, and characterization of electronic package systems. Dr. Rafiee has developed innovative designs, materials, and processes utilizing advanced manufacturing technologies to achieve new functionalities. He has authored over 50 research publications in peer-reviewed international journals and conferences, with more than 3000 citations (h-index 28), and has contributed as the sole author of a book. He is a recipient of prestigious honors and awards, including the Ontario Trillium Scholarship and the Fonds de Recherche du Québec – Nature et technologies (FRQNT). Dr. Rafiee was recognized as one of the World’s Top 2% Scientists in 2020 by Stanford University and is among the top 1% most highly cited authors in materials science. Additionally, he has served as an Associate Editor, Guest Editor, and editorial board member for various scientific journals.
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