Semiconductor Packaging Professors in Global

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Mohammad Rafiee
University of Ottawa Canada
semiconductor packaging
microelectronic packaging manufacturing
wafer-level packaging
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Jm Goddard
Cornell University Netherlands
food packaging
intelligent packaging
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Lionel Kimerling
Massachusetts Institute of Technology United States of America
semiconductor materials
semiconductor devices
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Mahi Singh
Western University Canada
semiconductor nanostructures
semiconductors
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Mahi Singh
Western University Canada
semiconductor nanostructures
semiconductors
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Ibrahim Sari
University of Southampton United Kingdom
advanced packaging
semiconductors
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Guy Curry
Texas A&M University United States of America
semiconductor packaging
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Jihoon Jeong
Texas A&M University United States of America
semiconductor packaging
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Li Ran
University of Warwick United Kingdom
power semiconductors packaging
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
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Kenneth Liechti
University of Texas at Austin United States of America
microelectronics packaging
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
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Johan Liu
Chalmers University of Technology Sweden
microsystems packaging
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Prem Chahal
Michigan State University United States of America
microsystems packaging
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Premjeet Chahal
Michigan State University United States of America
microsystems packaging
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Rao Tummala
Georgia Institute of Technology United States of America
microsystems packaging
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Masaki Takahashi
Aalborg University Denmark
power electronics packaging
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Rony Amaya
Carleton University Canada
packaging
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Judd Michael
Pennsylvania State University United States of America
packaging
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Gregory Rutledge
Massachusetts Institute of Technology United States of America
packaging
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Sandra Krahn
Technical University of Berlin Germany
packaging
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