Wafer Level Packaging Professors in Global

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Mohammad Rafiee
University of Ottawa Canada
wafer-level packaging
semiconductor packaging
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Göran Stemme
Royal Institute of Technology Sweden
wafer-level packaging
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George Shaker
University of Waterloo Canada
microwave packaging
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Jm Goddard
Cornell University Netherlands
food packaging
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Grete Bertelsen
University of Copenhagen Denmark
food packaging
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Sabina Rietz Dahlström
KTH Royal Institute of Technology Sweden
food packaging
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Richard Olsson
KTH Royal Institute of Technology Sweden
food packaging
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Erica Van Herpen
Wageningen University & Research Netherlands
food packaging
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Tamer Uyar
Cornell University Netherlands
food packaging
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Helene Hopfer
Pennsylvania State University United States of America
food packaging
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Rony Amaya
Carleton University Canada
packaging
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Judd Michael
Pennsylvania State University United States of America
packaging
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Gregory Rutledge
Massachusetts Institute of Technology United States of America
packaging
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Sandra Krahn
Technical University of Berlin Germany
packaging
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Amir Bahman
Aalborg University Denmark
packaging
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Renee Wever
Linköping University Sweden
packaging
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Ellis Meng
University of Southern California United States of America
packaging
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Judd Michael
Pennsylvania State University United States of America
packaging
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Michel Nakhla
Carleton University Canada
packaging
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Mikael Hedenqvist
KTH Royal Institute of Technology Sweden
packaging materials
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Guy Curry
Texas A&M University United States of America
semiconductor packaging
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