3d Passive Power Interposer Technology Professors in Global

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Ömer Altan
Technical University of Denmark Denmark
3d integrated power supplies
high-density capacitive power interposer technology
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Shuangyue Yang
Technical University of Denmark Denmark
3d passive power interposer technology
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Flemming Jensen
Technical University of Denmark Denmark
power interposer technology
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Sung Lim
University of Southern California United States of America
3d integrated circuits
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Tathagata Srimani
Carnegie Mellon University United States of America
3d integrated circuits
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Rudy Lauwereins
KU Leuven Belgium
3d integration technology
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Gijs Krijnen
University of Twente Netherlands
3d printed transducers
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Femke Schröder
University of Twente Netherlands
3d imaging technology
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Kok Chan
University of New South Wales Australia
3d integration technologies
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Kirsten Thomsen
Aalborg University Denmark
passive energy technologies
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Jessica Boles
University of California, Berkeley United States of America
passive component design
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John Back
University of Warwick United Kingdom
3d detector technology
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Troy Morgan
New York University Tandon School of Engineering United States of America
passive energy dissipation systems
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Bart Van Meerbeek
KU Leuven Belgium
3d printing technology
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Timothy Siu
Macquarie University Australia
3d printing technology
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Xin Teoh
Monash University Australia
3d printing technology
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Syed Abbas
Macquarie University Australia
3d printing technology
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Cornell University Netherlands
3d battery architecture
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Daniel Wiznia
Yale University United States of America
3d technology
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Stephen Hallett
University of Bristol United Kingdom
3d reinforced composites
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Elona Van Gent
University of Michigan Stamps School of Art & Design United States of America
3d technologies
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