Nems Sensor Systems Packaging Harsh Environments Professors in Global

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Wen Li
Michigan State University United States of America
nems technologies
microsystem integration packaging
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Jeffrey Prinzie
KU Leuven Belgium
harsh environment electronics
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Kaka Ma
Texas A&M University United States of America
materials in harsh environments
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Henry Sodano
University of Michigan United States of America
nems sensors
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Shubhra Bansal
Purdue University United States of America
harsh environment electronics integration
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Andreas Thorsen
Technical University of Denmark Denmark
modeling harsh conditions
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Johan Liu
Chalmers University of Technology Sweden
microsystems packaging
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Prem Chahal
Michigan State University United States of America
microsystems packaging
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Premjeet Chahal
Michigan State University United States of America
microsystems packaging
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Rao Tummala
Georgia Institute of Technology United States of America
microsystems packaging
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Leif Johansen
Technical University of Denmark Denmark
mems packaging
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Jongjuhan Park
Toronto Metropolitan University Canada
sustainable packaging systems design
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Mark Zondlo
Princeton University United States of America
environmental sensor systems
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Ju Li
Massachusetts Institute of Technology United States of America
materials in extreme environments
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Peter Hosemann
University of California, Berkeley United States of America
materials in extreme environments
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Stephen Raiman
University of Michigan United States of America
materials in extreme environments
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Bilal Mansoor
Texas A&M University United States of America
materials in extreme environments
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Thi Nguyen
Technical University of Denmark Denmark
nems devices
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Don Lipkin
Texas A&M University United States of America
coatings for harsh-environment testing
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Cole Van De Ven
Carleton University Canada
environmental sensors
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Sten Vollebregt
Delft University of Technology Netherlands
environmental sensors
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