Microsystem Integration Packaging Professors in Global

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Mohammad Rafiee
University of Ottawa Canada
semiconductor packaging
microelectronic packaging manufacturing
wafer-level packaging
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Jm Goddard
Cornell University Netherlands
intelligent packaging
food packaging
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Sandra Krahn
Technical University of Berlin Germany
packaging
materials for microsystems
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Muhannad Bakir
Georgia Institute of Technology United States of America
2.5d and 3d ic packaging
heterogeneous microsystem design integration
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Ellis Meng
University of Southern California United States of America
packaging
multimodality integrated microsystems
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Patricia Nieva
University of Waterloo Canada
integrated microsystems
nems sensor systems packaging harsh environments
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Jongjuhan Park
Toronto Metropolitan University Canada
sustainable packaging systems design
packaging distribution logistics
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Kelly Griendling
Georgia Institute of Technology United States of America
systems integration
complex systems integration
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Ilknur Ilhan
University of Twente Netherlands
sustainable packaging
dynamic modified atmosphere packaging
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Gary Fedder
Carnegie Mellon University United States of America
implantable microsystems
design and fabrication of integrated micro
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Göran Stemme
Royal Institute of Technology Sweden
device integration
wafer-level packaging
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Bruno Frazier
Georgia Institute of Technology United States of America
microsystems technology
microsystems fabrication technologies
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Wen Li
Michigan State University United States of America
microsystem integration packaging
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Premjeet Chahal
Michigan State University United States of America
microsystems packaging
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Prem Chahal
Michigan State University United States of America
microsystems packaging
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Johan Liu
Chalmers University of Technology Sweden
microsystems packaging
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Rao Tummala
Georgia Institute of Technology United States of America
microsystems packaging
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Kenneth Liechti
University of Texas at Austin United States of America
microelectronics packaging
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
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Rui Huang
University of Texas at Austin United States of America
packaging microelectronics
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