Microelectronics Packaging Professors in Global

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Mohammad Rafiee
University of Ottawa Canada
microelectronic packaging manufacturing
semiconductor packaging
wafer-level packaging
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
microelectronics cooling
microelectromechanical systems
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Xiao Sun
University of Western Australia Australia
microelectronics
microfabrication
microelectromechanical systems
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Johan Liu
Chalmers University of Technology Sweden
microsystems packaging
microtechnology
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Leif Johansen
Technical University of Denmark Denmark
mems packaging
microelectronics
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Paul Kohl
Georgia Institute of Technology United States of America
electronic packaging
microelectromechanical systems
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Jm Goddard
Cornell University Netherlands
food packaging
intelligent packaging
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Sandra Krahn
Technical University of Berlin Germany
packaging
materials for microsystems
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Paul Ho
University of Texas at Austin United States of America
microelectronics
interconnect packaging applications
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Yuan Ma
Dalhousie University Canada
microelectronics fabrication
microelectromechanical systems
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Andreas Hierlemann
ETH Zurich Switzerland
microelectronics
microtechnology
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Niklas Rorsman
Chalmers University of Technology Sweden
microwave electronics
microtechnology
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Dan Kuylenstierna
Chalmers University of Technology Sweden
microwave electronics
microtechnology
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Christian Fager
Chalmers University of Technology Sweden
microwave electronics
microtechnology
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Pengpeng Sun
Chalmers University of Technology Sweden
microwave electronics
microtechnology
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Michel Godin
University of Ottawa Canada
microfabrication
microdevices
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Ian Foulds
University of British Columbia Canada
microfabrication
microelectromechanical systems
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Ridha Ben Mrad
University of Toronto Canada
microfabrication
microelectromechanical systems
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Ilknur Ilhan
University of Twente Netherlands
sustainable packaging
dynamic modified atmosphere packaging
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Brian Stoner
Duke University Singapore
vacuum microelectronics
microelectromechanical systems
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Kenneth Liechti
University of Texas at Austin United States of America
microelectronics packaging
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