Packaging Microelectronics Professors in Global

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Mohammad Rafiee
University of Ottawa Canada
microelectronic packaging manufacturing
semiconductor packaging
wafer-level packaging
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
microtechnologies
microelectronics cooling
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Johan Liu
Chalmers University of Technology Sweden
microsystems packaging
microtechnology
nanoelectronics
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Jm Goddard
Cornell University Netherlands
food packaging
intelligent packaging
active packaging
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Amirnaser Yazdani
Toronto Metropolitan University Canada
industrial electronics
consumer electronics
power electronics
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
microelectronics cooling
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Kenneth Liechti
University of Texas at Austin United States of America
microelectronics packaging
micromechanics
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Leif Johansen
Technical University of Denmark Denmark
microelectronics
mems packaging
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Sandra Krahn
Technical University of Berlin Germany
packaging
materials for microsystems
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Xiao Sun
University of Western Australia Australia
microelectronics
microfabrication
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James Sturm
Princeton University United States of America
microelectronics
macroelectronics
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Paul Ho
University of Texas at Austin United States of America
microelectronics
interconnect packaging applications
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Li Ran
University of Warwick United Kingdom
power semiconductors packaging
power electronics
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Andreas Hierlemann
ETH Zurich Switzerland
microelectronics
microtechnology
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Tricia Carmichael
University of Windsor Canada
smart packaging
printed electronics
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Rainer Waser
RWTH Aachen University Germany
microelectronics
nanoelectronics
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Bernard Stark
University of Bristol United Kingdom
microelectronics
power electronics
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Tricia Carmichael
University of Windsor Canada
smart packaging
printed electronics
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Vincent Aimez
University of Sherbrooke Canada
microelectronics
nanoelectronics
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Maia Vergniory
University of Sherbrooke Canada
microelectronics
nanoelectronics
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Vincent Aimez
University of Sherbrooke Canada
microelectronics
nanoelectronics
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