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Power Electronics Packaging
Power Electronics Packaging Professors in Global
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Professor
Amirnaser Yazdani
Toronto Metropolitan University
Canada
power electronics
industrial electronics
consumer electronics
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Professor
Jm Goddard
Cornell University
Netherlands
food packaging
intelligent packaging
active packaging
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Professor
Li Ran
University of Warwick
United Kingdom
power semiconductors packaging
power electronics
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Professor
Farshid Naseri
Aalborg University
Denmark
power electronics
power electronics controls
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Professor
Kaichen Zhang
Aalborg University
Denmark
power electronics
electronics manufacturing
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Professor
Amir Bahman
Aalborg University
Denmark
packaging
power electronics converters
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Professor
Gao Liu
Aalborg University
Denmark
power electronics
heavy duty power electronics
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Professor
Saeed Jahdi
University of Bristol
United Kingdom
power electronics
high voltage power electronics
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Professor
Mohammad Rafiee
University of Ottawa
Canada
semiconductor packaging
microelectronic packaging manufacturing
electronic materials
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Professor
Tricia Carmichael
University of Windsor
Canada
smart packaging
printed electronics
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Professor
Tricia Carmichael
University of Windsor
Canada
smart packaging
printed electronics
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Professor
Peter Gammon
University of Warwick
United Kingdom
power electronic devices
silicon carbide power electronics
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Professor
Tania Roy
Duke University
Singapore
high power electronics
energy-efficient electronics
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Professor
Tania Roy
Duke University
Singapore
high power electronics
energy-efficient electronics
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Professor
Yuning Li
University of Waterloo
Canada
printed electronics
electronic materials
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Professor
Masaki Takahashi
Aalborg University
Denmark
power electronics packaging
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Professor
Steve Taylor
University College London
United Kingdom
electronic packaging
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Professor
Mustafa Yavuz
University of Waterloo
Canada
electronic packaging
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Professor
Paul Kohl
Georgia Institute of Technology
United States of America
electronic packaging
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Professor
Julien Sylvestre
University of Sherbrooke
Canada
microelectronics packaging
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Professor
Kenneth Liechti
University of Texas at Austin
United States of America
microelectronics packaging
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