Micro Electronic Packaging Professors in Global

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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
microelectromechanical systems
microelectronics cooling
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
microelectronics cooling
microtechnologies
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Xiao Sun
University of Western Australia Australia
microelectronics
microfabrication
microelectromechanical systems
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Thomas Jackson
Pennsylvania State University United States of America
electronic materials
microfabrication
flexible electronics
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Ian Hunter
Massachusetts Institute of Technology United States of America
micro-fabrication
micro-instrumentation
micro-robotics
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Amirnaser Yazdani
Toronto Metropolitan University Canada
industrial electronics
consumer electronics
power electronics
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Limei Tian
Texas A&M University United States of America
microfabrication
micro
flexible electronics
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David Cappelleri
Purdue University United States of America
mobile micro
micro
microelectromechanical systems
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Andrew Holmes
Imperial College London United Kingdom
micro-electro-mechanical systems
micro-power generation
micro-assembly techniques
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Paul Kohl
Georgia Institute of Technology United States of America
electronic packaging
microelectromechanical systems
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Rao Tummala
Georgia Institute of Technology United States of America
microsystems packaging
electronic materials
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Premjeet Chahal
Michigan State University United States of America
microsystems packaging
flexible electronics
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Johan Liu
Chalmers University of Technology Sweden
microsystems packaging
microtechnology
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Mohammad Rafiee
University of Ottawa Canada
microelectronic packaging manufacturing
semiconductor packaging
electronic materials
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Leif Johansen
Technical University of Denmark Denmark
mems packaging
microelectronics
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Niall Tait
Carleton University Canada
micro-fabrication
micro-electro-mechanical systems
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Yueh-lin Loo
Princeton University United States of America
plastic electronics
thin-film electronics
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Kaichen Zhang
Aalborg University Denmark
electronics manufacturing
power electronics
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Brian Bech Nielsen
Aarhus University Denmark
microelectronics
electronics
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Tricia Carmichael
University of Windsor Canada
smart packaging
printed electronics
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Tricia Carmichael
University of Windsor Canada
smart packaging
printed electronics
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