Micro Electronic Packaging Professors in Global

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Harry Kwok
University of Victoria Canada
electronic materials
molecular electronic devices
electronic devices
electronic materials science
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Mohammad Rafiee
University of Ottawa Canada
microelectronic packaging manufacturing
semiconductor packaging
electronic materials
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Julien Sylvestre
University of Sherbrooke Canada
microelectronics packaging
microelectromechanical systems
microelectronics cooling
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Xiao Sun
University of Western Australia Australia
microelectronics
microfabrication
microelectromechanical systems
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Thomas Jackson
Pennsylvania State University United States of America
electronic materials
microfabrication
flexible electronics
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Ian Hunter
Massachusetts Institute of Technology United States of America
micro-fabrication
micro-instrumentation
micro-robotics
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Peter Hesketh
Georgia Institute of Technology United States of America
microfabrication
micro
micro and nano engineering
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Amirnaser Yazdani
Toronto Metropolitan University Canada
industrial electronics
consumer electronics
power electronics
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Limei Tian
Texas A&M University United States of America
microfabrication
micro
flexible electronics
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Peng Peng
University of Waterloo Canada
micro
nano electronics
micro welding
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Andrew Holmes
Imperial College London United Kingdom
micro-electro-mechanical systems
micro-power generation
micro-assembly techniques
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William Wong
University of Waterloo Canada
printed electronics
nano-microfabrication
flexible electronics
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Mónica Acuautla Meneses
University of Groningen Netherlands
micro
nano electronics
flexible electronics
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Cyrus Shafai
University of Manitoba Canada
micro-electro-mechanical systems
biomedical micro-devices
micro-sensors
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Rui Huang
University of Texas at Austin United States of America
packaging microelectronics
micro
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Paul Kohl
Georgia Institute of Technology United States of America
electronic packaging
microelectromechanical systems
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Rao Tummala
Georgia Institute of Technology United States of America
microsystems packaging
electronic materials
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Premjeet Chahal
Michigan State University United States of America
microsystems packaging
flexible electronics
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Johan Liu
Chalmers University of Technology Sweden
microsystems packaging
microtechnology
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Wen Li
Michigan State University United States of America
microsystem integration packaging
micro sensors
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Leif Johansen
Technical University of Denmark Denmark
mems packaging
microelectronics
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